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This is the free Material Data Center Datasheet of LEXAN™ Copolymer MPX2 - Asia - PC - Saudi Basic Industries Corporation (SABIC)

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材料文字说明
LEXAN MPX2 polycarbonate (PC) siloxane copolymer resin is a injection molding (IM) grade with release properties. This resin offers good low temperature ductility in combination with medium flow characteristics and excellent processability with opportunities for shorter IM cycle times compared to standard IM PC resins. LEXAN MPX2 resin is a general purpose product available for wide range of colors and may be an excellent candidate for a broad range of applications.

UL Yellow Card Link E207780-102102565
加工/物理特性价值单位Test Standard
ISO数据
熔体体积流动速度, MVR 13 cm³/10min ISO 1133
温度 300 °C -
载荷 1.2 kg -
ASTM数据
熔融指数, MFI 14 g/10min ASTM D 1238
温度 300 °C -
负载 1.2 kg -
机械性能价值单位Test Standard
ASTM数据
拉伸模量 2100 MPa ASTM D 638
屈服应力 57 MPa ASTM D 638
断裂拉伸强度 56 MPa ASTM D 638
屈服伸长率 4.8 % ASTM D 638
断裂伸长率 90 % ASTM D 638
弯曲模量 2100 MPa ASTM D 790
悬臂梁缺口冲击强度, 1/8 in 810 J/m ASTM D 256
低温悬臂梁缺口冲击强度, Low-Temperature 650 J/m ASTM D 256
温度 -30 °C -
热性能价值单位Test Standard
ISO数据
维卡软化温度, 120°C/h 50N 138 °C ISO 306
厚度为h时的燃烧性 HB class IEC 60695-11-10
测试用试样的厚度 0.5 mm -
ASTM数据
DTUL @ 264 psi 116 °C ASTM D 648
其它性能价值单位Test Standard
吸水性 0.12 % 类似ISO 62
吸湿性 0.09 % 类似ISO 62
密度 1190 kg/m³ ISO 1183
密度 1180 kg/m³ ASTM D 792
加工推荐(注塑)价值单位Test Standard
预干燥-温度 120 °C -
预干燥-时间 3 - 4 h -
加工湿度 ≤0.02 % -
注塑熔体温度 295 - 315 °C -
模具温度 70 - 95 °C -
1区 270 - 295 °C -
2区 280 - 305 °C -
3区 295 - 315 °C -
螺杆转速 40 - 70 rpm -
背压 0.3 - 0.7 MPa -
典型数据
加工方法
注塑
地区供应
亚太
权利义务的法律声明
Copyright Altair Engineering GmbH. Altair Engineering GmbH assumes no liability for the system to be free of errors. The user takes sole responsibility for the use of this data under the exclusion of every liability from Altair Engineering GmbH; this is especially valid for claims of compensation resulting from consequential damages. Altair explicitly points out that any decision about the application of materials must be double checked with the producer of this material. This includes all contents of this system. Copyright laws are applicable for the content of this system.
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