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This is the free Material Data Center Datasheet of HOSTAFORM® C 9021 ECO-B - POM - Celanese

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제품 설명서
Chemical abbreviation according to ISO 1043-1: POM Molding compound ISO 29988- POM-K, M-GNR, 03-002 POM copolymer Standard-Injection molding type with high rigidity, hardness and toughness; good chemical resistance to solvents, fuel and strong alkalis as well as good hydrolysis resistance; high resistance to thermal and oxidative degradation. Monomers and additives are listed in EU-Regulation (EU) 10/2011 FDA compliant according to 21 CFR 177.2470 .Burning rate ISO 3795 and FMVSS 302 < 75 mm/min for a thickness more than 1 mm. Ranges of applications: automotive engineering, precision engineering, electric and electronical industry, domestic appliances. FDA = Food and Drug Administration (USA) FMVSS = Federal Motor Vehicle Safety Standard (USA) UL = Underwriters Laboratories (USA).
ECO-B: Hostaform ECO-B is a POM-Copolymer with the same properties and performance as standard grades but produced with sustainability in mind. Using a mass-balance approach, biogenic feedstocks are used to offset the use of fossil-based raw materials and decrease greenhouse gas emissions. The process is audited and certified according to the ISCC Plus mass balance approach.

Flammability @1.6mm nom. thickn.HB-
Flammability at thickness h (3 mm)HBUL recognition (h)
Processing/Physical Characteristics단위시험규격
ISO 데이터
용융 부피 - 흐름 속도, MVR 8 cm³/10min ISO 1133
온도 190 °C -
하중 2.16 kg -
성형 수축률, 평행 2.0 % ISO 294-4, 2577
성형 수축률, 수직 1.9 % ISO 294-4, 2577
용융 밀도 1200 kg/m³ -
용융 열전도율 0.155 W/(m K) -
용융 비열용량 2210 J/(kg K) -
효율적 열전도도 4.85E-8 m²/s -
이형온도 140 °C -
기계적 특성단위시험규격
ISO 데이터
인장탄성률 2850 MPa ISO 527
항복강도 64 MPa ISO 527
항복변형률 9 % ISO 527
파단시 평균신율 30 % ISO 527
챠피 충격 강도 , +23°C 220 kJ/m² ISO 179/1eU
챠피 충격 강도, -30°C 220 kJ/m² ISO 179/1eU
챠피 노치드 충격 강도, +23°C 6.5 kJ/m² ISO 179/1eA
챠피 노치드 충격 강도, -30°C 6 kJ/m² ISO 179/1eA
열적 특성단위시험규격
ISO 데이터
녹는점, 10°C/min 166 °C ISO 11357-1/-3
하중하에서의 변형온도, 1.80 MPa 104 °C ISO 75-1/-2
하중하에서의 변형온도, 0.45 MPa 160 °C ISO 75-1/-2
선형 열팽창 계수, 평행 110 E-6/K ISO 11359-1/-2
선형 열팽창 계수, 수직 110 E-6/K ISO 11359-1/-2
1.5mm 평균두께에서의 난연성 HB class IEC 60695-11-10
테스트 두께 1.5 mm -
두께 H인 제품의 난연성 HB class IEC 60695-11-10
테스트 두께 3.0 mm -
Yellow Card 유효한 - -
전기적 특성단위시험규격
ISO 데이터
상대 유전율, 100Hz 4 - IEC 62631-2-1
상대 유전뮬, 1MHz 4 - IEC 62631-2-1
소산 인자, 100Hz 20 E-4 IEC 62631-2-1
소산 인자, 1MHz 50 E-4 IEC 62631-2-1
부피 저항 1E12 Ohm*m IEC 62631-3-1
표면 저항 1E14 Ohm IEC 62631-3-2
전기 압력 35 kV/mm IEC 60243-1
기타 특성단위시험규격
물에서의 흡수성 0.65 % ISO 62와 유사
조건에서의 흡습성 0.2 % ISO 62와 유사
밀도 1410 kg/m³ ISO 1183
도표
점도-변형률 , HOSTAFORM® C 9021 ECO-B, POM, Celanese
전단-변형률 , HOSTAFORM® C 9021 ECO-B, POM, Celanese
동전단탄성율-온도 , HOSTAFORM® C 9021 ECO-B, POM, Celanese
응력-신율 , HOSTAFORM® C 9021 ECO-B, POM, Celanese
시컨트탄성율-신율 , HOSTAFORM® C 9021 ECO-B, POM, Celanese
응력-신율(등시) 23°C, HOSTAFORM® C 9021 ECO-B, POM, Celanese
크립탄성율-시간 23°C, HOSTAFORM® C 9021 ECO-B, POM, Celanese
곡선 크리프 23°C, HOSTAFORM® C 9021 ECO-B, POM, Celanese
특징
생산 공정
사출 성형, 필름 압출, 외형 압출, 시트 압출, 기타 압출, 중공 성형
인도 유형
펠렛 (입자,알갱이)
부가물
이형제
특성
Copolymer
내화학성에
Alkali Resistance, Solvent Resistance, Hydrolytically Stable
Certifications
Contains renewable resources, Food contact, Food approval 10/2011, Food approval FDA 21 CFR, ISCC Plus
응용
자동차의, 전기 및 전자
지역별 검색
기타 정보
사E성
General drying is not necessary due to low moisture absorption of
the resin.

In case of bad storage conditions (water contact or condensed water)
the use of a recirculating air dryer (100 to 120 °C / max. 40 mm
layer / 3 to 6 hours) is recommended.

Max. Water content 0,2 %
Standard injection moulding machines with three phase (15 to 25 D)
plasticating screws will fit.

Conditioning e.g. moisturizing is not necessary.
필름 압출
General drying is not necessary due to low moisture absorption of
the resin.

In case of bad storage conditions (water contact or condensed water)
the use of a recirculating air dryer (100 to 120 °C / max. 40 mm
layer / 3 to 6 hours) is recommended.

Max. Water content 0,2 %
Standard extruders with grooved feed zone and short compression
screws (minimum 25 D) will fit.

Melt temperature 180-190 °C
Conditioning e.g. moisturizing is not necessary.

In case of very thick wall thickness profiles after-annealing it is
recommended to reduce internal stress.

Annealing temperature 130-140 °C
Annealing time 10 min/mm thickness
기타 압출
General drying is not necessary due to low moisture absorption of
the resin.

In case of bad storage conditions (water contact or condensed water)
the use of a recirculating air dryer (100 to 120 °C / max. 40 mm
layer / 3 to 6 hours) is recommended.

Max. Water content 0,2 %

Standard extruders with grooved feed zone and short compression
screws (minimum 25 D) will fit.

Melt temperature 180-190 °C



Conditioning e.g. moisturizing is not necessary.

In case of very thick wall thickness profiles after-annealing it is
recommended to reduce internal stress.

Annealing temperature 130-140 °C
Annealing time 10 min/mm thickness
시트 압
General drying is not necessary due to low moisture absorption of
the resin.

In case of bad storage conditions (water contact or condensed water)
the use of a recirculating air dryer (100 to 120 °C / max. 40 mm
layer / 3 to 6 hours) is recommended.

Max. Water content 0,2 %

Standard extruders with grooved feed zone and short compression
screws (minimum 25 D) will fit.

Melt temperature 180-190 °C



Conditioning e.g. moisturizing is not necessary.

In case of very thick wall thickness profiles after-annealing it is
recommended to reduce internal stress.

Annealing temperature 130-140 °C
Annealing time 10 min/mm thickness
Disclaimer
Copyright Altair Engineering GmbH. Altair Engineering GmbH assumes no liability for the system to be free of errors. The user takes sole responsibility for the use of this data under the exclusion of every liability from Altair Engineering GmbH; this is especially valid for claims of compensation resulting from consequential damages. Altair explicitly points out that any decision about the application of materials must be double checked with the producer of this material. This includes all contents of this system. Copyright laws are applicable for the content of this system.
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