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This is the free Material Data Center Datasheet of HOSTAFORM® C 27021 XAP® C - POM - Celanese

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Informations produit
POM copolymer Easy flow injection molding grade with very low emissions and migrations; designed for consumer packaging. Emission according to VDA 275 < 2 mg/kg (natural grades) Monomers and additives are listed in EU-Regulation (EU) 10/2011 FDA compliant according to 21 CFR 177.2470 FDA = Food and Drug Administration (USA)

Flammability @1.6mm nom. thickn.HB-
Flammability at thickness h (3 mm)HBUL recognition (h)
Caractéristiques des transformations/physiquesValeurUnitéNorme du test
ISO Data
Indice de fluidité à chaud en volume, MVR 24 cm³/10min ISO 1133
Température 190 °C -
Charge 2.16 kg -
Retrait au moulage, parallèle 1.9 % ISO 294-4, 2577
Retrait au moulage, perpendiculaire 1.8 % ISO 294-4, 2577
Densité du fondu 1200 kg/m³ -
Conductivité thermique du fondu 0.155 W/(m K) -
Chaleur spécifique du fondu 2210 J/(kg K) -
Température d'éjection 140 °C -
Propriétés mécaniquesValeurUnitéNorme du test
ISO Data
Module en traction 2900 MPa ISO 527
Contrainte d'écoulement 65 MPa ISO 527
Déformation au seuil d'écoulement 7.5 % ISO 527
Déformation nominale à la rupture 17 % ISO 527
Résistance au choc Charpy, +23°C 170 kJ/m² ISO 179/1eU
Résistance au choc Charpy, -30°C 170 kJ/m² ISO 179/1eU
Résistance au choc Charpy (entaillé), +23°C 5.5 kJ/m² ISO 179/1eA
Résistance au choc Charpy (entaillé), -30°C 5.5 kJ/m² ISO 179/1eA
Propriétés thermiquesValeurUnitéNorme du test
ISO Data
Température de fusion, 10°C/min 166 °C ISO 11357-1/-3
Température de fléchissement s/chrg, 1.80 MPa 106 °C ISO 75-1/-2
Coeffic. de dilatation therm. linéique, parallèle 110 E-6/K ISO 11359-1/-2
Inflammabilité ep. nom. 1.5 mm HB class IEC 60695-11-10
Epaisseur de l'éprouvette 1.5 mm -
Inflammabilité pr. épaisseur h HB class IEC 60695-11-10
Epaisseur de l'éprouvette 3.0 mm -
Yellow Card disponible oui - -
Propriétés électriquesValeurUnitéNorme du test
ISO Data
Permittivité relative, 100Hz 4 - IEC 62631-2-1
Permittivité relative, 1MHz 4 - IEC 62631-2-1
Facteur de pertes, 100Hz 25 E-4 IEC 62631-2-1
Facteur de pertes, 1MHz 50 E-4 IEC 62631-2-1
Résistivité transversale 1E12 Ohm*m IEC 62631-3-1
Résistivité superficielle 1E14 Ohm IEC 62631-3-2
Rigidité diélectrique 35 kV/mm IEC 60243-1
Propriétés diversesValeurUnitéNorme du test
Absorption d'eau 0.65 % Sim. to ISO 62
Absorption d'humidité 0.2 % Sim. to ISO 62
Masse volumique 1410 kg/m³ ISO 1183
Fonctions
Viscosité / Vitesse de cisaillement , HOSTAFORM® C 27021 XAP® C, POM, Celanese
Contrainte de cisaillement / Vit. de cisaillement , HOSTAFORM® C 27021 XAP® C, POM, Celanese
Module de cisaillement dynamique / Température , HOSTAFORM® C 27021 XAP® C, POM, Celanese
Contrainte / Déformation , HOSTAFORM® C 27021 XAP® C, POM, Celanese
Module sécant / Déformation , HOSTAFORM® C 27021 XAP® C, POM, Celanese
Caractéristiques
Transformation
Moulage par injection
Conditionnement
Granulés
Additifs
Agent de démoulage
Caractéristiques
Low Emission, Copolymère
Certifications
Contact alimentaire, Approuvé pour le contact alimentaire suivant 10/2011, FDA 21 CFR approbation
Applications
Emballage
Disponibilité régionale
Amérique du nord, Europe, Asia Pacific, South and Central America, Proche-Orient/Afrique
Autres informations
Moulages par injection
To achive low emission values pre drying using a recirculating air dryer (100 to 120 °C / max. 40 mm layer / 3 to 6 hours) is recommended.

Max. Water content 0,1 %
Standard injection moulding machines with three phase (15 to 25 D)
plasticating screws will fit.

Conditioning e.g. moisturizing is not necessary.
Conditions générales
Copyright Altair Engineering GmbH. Altair Engineering GmbH assumes no liability for the system to be free of errors. The user takes sole responsibility for the use of this data under the exclusion of every liability from Altair Engineering GmbH; this is especially valid for claims of compensation resulting from consequential damages. Altair explicitly points out that any decision about the application of materials must be double checked with the producer of this material. This includes all contents of this system. Copyright laws are applicable for the content of this system.
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