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This is the free Material Data Center Datasheet of ALTECH PA66 A 1000/310 IM - PA66 - MOCOM Compounds GmbH & Co. KG

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Propiedades mecánicas - Propiedades térmicas - Otras propiedades
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Texto del producto
Base PolymerPolyamide 66
Special Featuresheat stabilised,low temperature impact modified,easy flow,easy release (demoulding)
Typical Applicationshousings,various
Propiedades mecánicasSeco / CondUnidadesMétodo de ensayo
ISO Data
Módulo de tracción 2200 / 950 MPa ISO 527
Esfuerzo de fluencia 55 / 35 MPa ISO 527
Alarg. en límite elástico 4.5 / 18 % ISO 527
Resistencia al impacto Charpy, +23°C N / N kJ/m² ISO 179/1eU
Resistencia al impacto Charpy c/entalla, +23°C 60 / 100 kJ/m² ISO 179/1eA
Propiedades térmicasSeco / CondUnidadesMétodo de ensayo
ISO Data
Estabilidad al calor, 1.80 MPa 70 / * °C ISO 75-1/-2
Otras propiedadesSeco / CondUnidadesMétodo de ensayo
Densidad 1100 / - kg/m³ ISO 1183
Características
Procesamiento y forma de entrega
Moldeo por inyección
Características especiales
Alto impacto o modificado al impacto, Estable contra el calor
Disponibilidad regional
Norteamérica, Europa, Asia Pacifico, América del Sur y Centroaméric, Próximo Oriente/Africa
Demás información
Moldeo por inyección
Pre-Drying Conditions80 °C in a dry air (dessiccant) dryer
for 2-12 h
dependant on moisture content
max. moisture content <0,15 %
Processing Injection Mouldingmelt temperature 270-290 °C
mould temperature 40-80 °C
Storagedry, protected from light
Disclaimer
Copyright Altair Engineering GmbH. Altair Engineering GmbH assumes no liability for the system to be free of errors. The user takes sole responsibility for the use of this data under the exclusion of every liability from Altair Engineering GmbH; this is especially valid for claims of compensation resulting from consequential damages. Altair explicitly points out that any decision about the application of materials must be double checked with the producer of this material. This includes all contents of this system. Copyright laws are applicable for the content of this system.
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