Tecacomp - TP - Ensinger

Kunststoffe international, 2011-09-23, Light in Weight, High in Performance
Anew compound with the trade name Tecacomp LW (low weight) comprises the thermoplastic polyetheretherketone (PEEK) or polyamide 6 (PA6) and up to 40 wt.-% hollow glass microspheres. It has a density of less than 1.0 g/cm3. In comparison with previously used, glass-fiber-reinforced grades, the new material offers weight savings of up to 40 % and price advantages. Further development of this lightweight construction material requires demonstrating its processability on injection molding machines. ...

Kunststoffe international, 2015-07-20, Heat-Resistant and Heat-Conducting
...st be chosen carefully because they have a significant impact on coating quality and the functionality of the conductive paths: current will not flow across breaks in the paths. Blurry edges give rise to arcing between the conductive paths. Both Tecacomp PEEK LDS and Tecacomp LCP LDS are optimized for extremely narrow conductive paths and can accommodate complex circuits in a small space. They have been specially modified (fillers, additives and compounding technology) to achieve closely spaced ...

Kunststoffe international, 2015-07-20, Three-Dimensional and with a Fine Structure
...ediate vicinity of the LED, keeping in mind that the efficiency is determined above all by the thickness of the metallization. An alternative to this is to use heat-conducting substrates. In the meantime, various materials, e. g. Tecacomp LDS 4109, a black polyphthalamide (PPA) from Ensinger GmbH, Nufringen, Germany, or Reny L455, a polyarylamide PA-MXD6 from Mitsubishi Engineering Plastics Corp., in white, have become available for manufacturing laser-structured MID components. The important as...

Kunststoffe international, 2017-02-23, Thermally Conductive Polymers Meet LED
...tance (e. g., lead-free soldering, 270 °C), combustibility (UL94-V0), as well as electrical insulation, and whose impact strength permits the conducting circuit to be applied by hot embossing. For the case in question, a polyamide 66 (Tecacomp PA66 manufactured by Ensinger GmbH) was selected that is filled with electrically insulating boron nitride (3M Boron Nitride Cooling Filler Platelets, type 15/400) to increase heat conductivity. Additional stabilizing is required to counteract heat and lig...