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This is the free Material Data Center Datasheet of HOSTAFORM® C 2521 10/1570 - POM - Celanese

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Product Texts
Chemical abbreviation according to ISO 1043-1: POM
Molding compound ISO 29988-POM-K,,M-GCL,01-002

Stiff-flowing type for injection molding and extrusion with high impact toughness and good tracking resistance over a high range of temperature; UV-stabilized with carbon black, good chemical resistance to solvents, fuel and strong alkalis as well as good hydrolysis resistance; high resistance to thermal and oxidative degradation.

Ranges of applications: injection molding thick-walled, void-free molded parts; extrusion e.g. for boards and pipes, exterior applications.

Flammability @1.6mm nom. thickn.HB-
Flammability at thickness h (3 mm)HBUL recognition (h)
Processing/Physical CharacteristicsValueUnitTest Standard
ISO Data
Melt volume-flow rate, MVR 2.5 cm³/10min ISO 1133
Temperature 190 °C -
Load 2.16 kg -
Molding shrinkage, parallel 2.1 % ISO 294-4, 2577
Molding shrinkage, normal 1.8 % ISO 294-4, 2577
Density of melt 1200 kg/m³ -
Thermal conductivity of melt 0.155 W/(m K) -
Spec. heat capacity of melt 2210 J/(kg K) -
Ejection temperature 140 °C -
Mechanical propertiesValueUnitTest Standard
ISO Data
Tensile Modulus 2600 MPa ISO 527
Yield stress 62 MPa ISO 527
Yield strain 9 % ISO 527
Nominal strain at break 32 % ISO 527
Charpy impact strength, +23°C 250 kJ/m² ISO 179/1eU
Charpy impact strength, -30°C 250 kJ/m² ISO 179/1eU
Charpy notched impact strength, +23°C 8.5 kJ/m² ISO 179/1eA
Charpy notched impact strength, -30°C 7 kJ/m² ISO 179/1eA
Thermal propertiesValueUnitTest Standard
ISO Data
Melting temperature, 10°C/min 165 °C ISO 11357-1/-3
Temp. of deflection under load, 1.80 MPa 101 °C ISO 75-1/-2
Coeff. of linear therm. expansion, parallel 110 E-6/K ISO 11359-1/-2
Burning Behav. at 1.5 mm nom. thickn. HB class IEC 60695-11-10
Thickness tested 1.5 mm -
Burning Behav. at thickness h HB class IEC 60695-11-10
Thickness tested 3.0 mm -
Yellow Card available yes - -
Electrical propertiesValueUnitTest Standard
ISO Data
Relative permittivity, 100Hz 4 - IEC 62631-2-1
Relative permittivity, 1MHz 4 - IEC 62631-2-1
Dissipation factor, 100Hz 15 E-4 IEC 62631-2-1
Dissipation factor, 1MHz 50 E-4 IEC 62631-2-1
Volume resistivity 1E12 Ohm*m IEC 62631-3-1
Surface resistivity 1E14 Ohm IEC 62631-3-2
Electric strength 35 kV/mm IEC 60243-1
Other propertiesValueUnitTest Standard
Water absorption 0.65 % Sim. to ISO 62
Humidity absorption 0.2 % Sim. to ISO 62
Density 1410 kg/m³ ISO 1183
Diagrams
Viscosity-shear rate , HOSTAFORM® C 2521 10/1570, POM, Celanese
Shearstress-shear rate , HOSTAFORM® C 2521 10/1570, POM, Celanese
Dynamic Shear modulus-temperature , HOSTAFORM® C 2521 10/1570, POM, Celanese
Stress-strain , HOSTAFORM® C 2521 10/1570, POM, Celanese
Secant modulus-strain , HOSTAFORM® C 2521 10/1570, POM, Celanese
Characteristics
Processing
Injection Molding, Film Extrusion, Profile Extrusion, Sheet Extrusion, Other Extrusion, Blow Molding
Delivery form
Pellets
Additives
Release agent
Special Characteristics
U.V. stabilized or stable to weather
Features
Copolymer
Other text information
Injection molding
General drying is not necessary due to low moisture absorption of
the resin.

In case of bad storage conditions (water contact or condensed water)
the use of a recirculating air dryer (100 to 120 °C / max. 40 mm
layer / 3 to 6 hours) is recommended.

Max. Water content 0,2 %
Standard injection moulding machines with three phase (15 to 25 D)
plasticating screws will fit.

Conditioning e.g. moisturizing is not necessary.
Film extrusion
General drying is not necessary due to low moisture absorption of
the resin.

In case of bad storage conditions (water contact or condensed water)
the use of a recirculating air dryer (100 to 120 °C / max. 40 mm
layer / 3 to 6 hours) is recommended.

Max. Water content 0,2 %

Standard extruders with grooved feed zone and short compression
screws (minimum 25 D) will fit.

Melt temperature 180-190 °C



Conditioning e.g. moisturizing is not necessary.

In case of very thick wall thickness profiles after-annealing it is
recommended to reduce internal stress.

Annealing temperature 130-140 °C
Annealing time 10 min/mm thickness
Other extrusion
General drying is not necessary due to low moisture absorption of
the resin.

In case of bad storage conditions (water contact or condensed water)
the use of a recirculating air dryer (100 to 120 °C / max. 40 mm
layer / 3 to 6 hours) is recommended.

Max. Water content 0,2 %

Standard extruders with grooved feed zone and short compression
screws (minimum 25 D) will fit.

Melt temperature 180-190 °C



Conditioning e.g. moisturizing is not necessary.

In case of very thick wall thickness profiles after-annealing it is
recommended to reduce internal stress.

Annealing temperature 130-140 °C
Annealing time 10 min/mm thickness
Profile extrusion
General drying is not necessary due to low moisture absorption of
the resin.

In case of bad storage conditions (water contact or condensed water)
the use of a recirculating air dryer (100 to 120 °C / max. 40 mm
layer / 3 to 6 hours) is recommended.

Max. Water content 0,2 %

Standard extruders with grooved feed zone and short compression
screws (minimum 25 D) will fit.

Melt temperature 180-190 °C



Conditioning e.g. moisturizing is not necessary.

In case of very thick wall thickness profiles after-annealing it is
recommended to reduce internal stress.

Annealing temperature 130-140 °C
Annealing time 10 min/mm thickness
Sheet extrusion
General drying is not necessary due to low moisture absorption of
the resin.

In case of bad storage conditions (water contact or condensed water)
the use of a recirculating air dryer (100 to 120 °C / max. 40 mm
layer / 3 to 6 hours) is recommended.

Max. Water content 0,2 %

Standard extruders with grooved feed zone and short compression
screws (minimum 25 D) will fit.

Melt temperature 180-190 °C



Conditioning e.g. moisturizing is not necessary.

In case of very thick wall thickness profiles after-annealing it is
recommended to reduce internal stress.

Annealing temperature 130-140 °C
Annealing time 10 min/mm thickness
Blow molding
General drying is not necessary due to low moisture absorption of
the resin.

In case of bad storage conditions (water contact or condensed water)
the use of a recirculating air dryer (100 to 120 °C / max. 40 mm
layer / 3 to 6 hours) is recommended.

Max. Water content 0,2 %

Standard extruders with plasticating screws (20 to 25 D) will fit.

Melt temperature 180-190 °C
Mould-surface temperature 60-100 °C



Conditioning e.g. moisturizing is not necessary.
Disclaimer
Copyright Altair Engineering GmbH. Altair Engineering GmbH assumes no liability for the system to be free of errors. The user takes sole responsibility for the use of this data under the exclusion of every liability from Altair Engineering GmbH; this is especially valid for claims of compensation resulting from consequential damages. Altair explicitly points out that any decision about the application of materials must be double checked with the producer of this material. This includes all contents of this system. Copyright laws are applicable for the content of this system.
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