Complete Set of CAMPUS® Data, ASTM Data, Biopolymer Database, Application Database, Tradename Database, Literature Database, Toolbox.

Material datasheets available free. Online registration at: www.materialdatacenter.com

Material Data Center is a leading international information system for the plastics industry. Material Data Center offers a comprehensive plastics database, calculation tools, CAE interfaces, a literature database and an application database. For more information about Material Data Center visit www.materialdatacenter.com.

This is the free Material Data Center Datasheet of KEBAFORM C 902 XFA - POM - Barlog plastics GmbH

Material Data Center offers the following functions for KEBAFORM C 902 XFA:
unit conversion, PDF datasheet print, comparison with other plastics, snap fit calculation, beam deflection calculation, CAE Interfaces

Check here, which other Kebaform datasheets, application examples or technical articles are available in Material Data Center

Use the following short links to get directly to the properties of interest in this datasheet:
Any use of this information falls under the rules of our disclaimer.
Caratteristiche FisicheValoreUnitáNorma del test
ISO Data
Indice di Fluiditá, MFI 9 g/10min ISO 1133
Temperatura 190 °C -
Carico 2.16 kg -
Ritiro di stampaggio, parallelo 2.0 % ISO 294-4, 2577
Ritiro di stampaggio, perpendicolare 2.0 % ISO 294-4, 2577
Proprietà MeccanicheValoreUnitáNorma del test
ISO Data
Modulo a trazione 2700 MPa ISO 527
Carico unitario a trazione 60 MPa ISO 527
Deformazione a snervamento 11 % ISO 527
Deformazione a rottura 40 % ISO 527
Resistenza all'urto Charpy, +23°C 100 kJ/m² ISO 179/1eU
Resist. urto Charpy con intaglio, +23°C 7 kJ/m² ISO 179/1eA
Proprietà TermicheValoreUnitáNorma del test
ISO Data
Temperatura di fusione, 10°C/min 170 °C ISO 11357-1/-3
Temp.di inflessione sotto carico, 1.80 MPa 93 °C ISO 75-1/-2
Coeff.di dilatazione termica lin., parallelo 120 E-6/K ISO 11359-1/-2
Coeff.di dilatazione termica lin. , perpend. 120 E-6/K ISO 11359-1/-2
Reazione al fuoco a spessore h HB class IEC 60695-11-10
Spessore provato 0.8 mm -
Proprietà ElettricheValoreUnitáNorma del test
ISO Data
Resistività volumica 1E16 Ohm*m IEC 62631-3-1
Resistività superficiale 1E16 Ohm IEC 62631-3-2
Rigidità dielettrica 19 kV/mm IEC 60243-1
Altre ProprietàValoreUnitáNorma del test
Assorbimento d'acqua 0.22 % Sim. alla ISO 62
Massa volumica 1410 kg/m³ ISO 1183
Raccomandazione de Processabilità Stampaggio ad IniezioneValoreUnitáNorma del test
Pre-essiccamento - Temperatura 80 °C -
Pre-essiccamento - Tempo 3 - 5 h -
Umidità del Processo ≤0.1 % -
Temperatura dello stampo 60 - 120 °C -
Temperatura - Zona di Alimentazione 60 - 80 °C -
Zona 1 180 - 220 °C -
Caratteristiche
Processabilità e Forma di Forni
Stampaggio ad Iniezione
Caratteristiche speciali
Estab. agli U.V. o per applicaz.in esterni
Caratteristiche
Low Emission, Grado tribologico, Copolimero
Resistenza Chimica
Resistenza chimica generale
Applicazioni
Automotive, Incapsulamento
Disponibilità geografica
Europa
Disclaimer
Copyright Altair Engineering GmbH. Altair Engineering GmbH assumes no liability for the system to be free of errors. The user takes sole responsibility for the use of this data under the exclusion of every liability from Altair Engineering GmbH; this is especially valid for claims of compensation resulting from consequential damages. Altair explicitly points out that any decision about the application of materials must be double checked with the producer of this material. This includes all contents of this system. Copyright laws are applicable for the content of this system.
Created: Source: www.materialdatacenter.com


Material Data Center is provided by M-Base Engineering + Software GmbH. M-Base Engineering + Software GmbH assumes no liability for the system to be free of errors. Any decision about the application of materials must be double checked with the producer of this material.

Additional information about this material, like producer contact address, etc. can be found at www.materialdatacenter.com. For access to this extra information a registration is requested. Free online registration is available.