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This is the free Material Data Center Datasheet of Bakelite® EP 8414 - EP-(GF+X) - Bakelite Synthetics

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Testo del prodotto

Product description:

Epoxy moulding compound, inorganically filled, glass fibre reinforced, highly heat resistant, good electrical properties, even at higher temperatures, very slight post shrinkage, increased media resistance, UL listed moulding compound 1.5 mm / HB (BK).

Application areas:

Electrical parts, thermally, chemically and mechanically stressed parts, e.g. terminal boards, bobbins, car electronic, reflectors, spark plug connectors.

Property Name Value Unit Standard No.
Apparent density (moulding compound) 0.8 g/cm³ ISO 60
Moulding shrinkage (injection moulding, longitudinal)  0.35 % ISO 2577
Post shrinkage (injection moulding, 168h/110°C) 0.05 % ISO 2577
Tensile strength (5mm/min) 70 MPa ISO 527-1/2
Compr. strength (test spec. flat tested) 150 MPa ISO 604
Flexural strength (2mm/min) 130 MPa ISO 178
Flexural modulus 15500 MPa ISO 178
Ball indentation hardness (H 961/30) 350 MPa ISO 2039/P1
Water absorption (24h/23°C) 13 mg similar to ISO 62
Additional characteristics: high arc resistance, improved electrical properties, low shrinkage/good dimensional stability

Preparation of Test Specimens of Thermosetting Moulding Compound

  • Compression to ISO 295
  • Injection to ISO 10724


Storage capability
6 months (relative humidity of 50-60% and maximum storage temperature of approximately 20°C)

Caratteristiche FisicheValoreUnitáNorma del test
ISO Data
Ritiro di stampaggio, parallelo 0.3 % ISO 294-4, 2577
Proprietà MeccanicheValoreUnitáNorma del test
ISO Data
Modulo a trazione 14000 MPa ISO 527
Resistenza all'urto Charpy, +23°C 9 kJ/m² ISO 179/1eU
Resistenzia all'urto Charpy con intaglio, +23°C 3 kJ/m² ISO 179/1eA
Proprietà TermicheValoreUnitáNorma del test
ISO Data
Temp.di inflessione sotto caricor, 8.00 MPa 115 °C ISO 75-1/-2
Proprietà ElettricheValoreUnitáNorma del test
ISO Data
Costante dielettrica relativa, 100Hz 5.5 - IEC 62631-2-1
Fattore di dissipazione, 100Hz 0.02 E-4 IEC 62631-2-1
Resistività volumica 1E11 Ohm*m IEC 62631-3-1
Resistività superficiale 1E12 Ohm IEC 62631-3-2
Rigidità dielettrica 24 kV/mm IEC 60243-1
Altre ProprietàValoreUnitáNorma del test
Massa volumica 1850 kg/m³ ISO 1183
Preparazione ProvetteValoreUnitáNorma del test
ISO Data
Stamp. ad Iniezione, temp. della massa d'iniez. 125 °C ISO 10724
Stamp. ad Iniezione, velocità media d'iniezione 170 mm/s ISO 10724
Stamp. ad Iniezione, pressione di chiusura 100 MPa ISO 10724
Stamp. ad Iniezione, tempo di postindurimento 25 min ISO 10724
Stamp. a Compr., temp. dello stampo 160 °C ISO 295
Stamp. a Compr., tempo di postindurimento 1 min ISO 295
Funzioni
Modulo dinamico a taglio-temperatura , Bakelite® EP 8414, EP-(GF+X), Bakelite Synthetics
Sforzi-deformazione , Bakelite® EP 8414, EP-(GF+X), Bakelite Synthetics
Modulo secante-deformazione , Bakelite® EP 8414, EP-(GF+X), Bakelite Synthetics
Caratteristiche
Processabilità e Forma di Forni
Stampaggio ad Iniezione, Stampaggio a Trasferimento
Disponibilità geografica
Altre informazioni
Stampaggio ad Iniezione
PROCESSING
Temperature of material:90 - 100°C
Mould temperature:170 - 190°C
Curing time:15-25sec
 
Further Information:
Barrel temperature
  - Feed zone:60-75°C
  - Nozzle zone: 70-100°C
Cavity moulding pressure:>10MPa
Back pressure: 0.5-2MPa
Holding-pressure: 60% of injection pressure
Stampaggio a Compressione
PROCESSING
Mould temperature:160-190°C
Curing time:30-60sec
Cavity moulding pressure:>10MPa
Disclaimer
Copyright Altair Engineering GmbH. Altair Engineering GmbH assumes no liability for the system to be free of errors. The user takes sole responsibility for the use of this data under the exclusion of every liability from Altair Engineering GmbH; this is especially valid for claims of compensation resulting from consequential damages. Altair explicitly points out that any decision about the application of materials must be double checked with the producer of this material. This includes all contents of this system. Copyright laws are applicable for the content of this system.
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