Complete Set of CAMPUS® Data, ASTM Data, Biopolymer Database, Application Database, Tradename Database, Literature Database, Toolbox.

Material datasheets available free. Online registration at: www.materialdatacenter.com

Material Data Center is a leading international information system for the plastics industry. Material Data Center offers a comprehensive plastics database, calculation tools, CAE interfaces, a literature database and an application database. For more information about Material Data Center visit www.materialdatacenter.com.

This is the free Material Data Center Datasheet of VESTAMID® L-GB30 - PA12-GB30 - Evonik Operations GmbH

Material Data Center offers the following functions for VESTAMID® L-GB30:
unit conversion, PDF datasheet print, comparison with other plastics, snap fit calculation, beam deflection calculation, parameters for material models, CAE Interfaces

Check here, which other Vestamid datasheets, application examples or technical articles are available in Material Data Center

Use the following short links to get directly to the properties of interest in this datasheet:
Any use of this information falls under the rules of our disclaimer.
Texto del producto

Microglass bead-filled (30%) PA12 resin for the injection moulding of rigid, low-warpage and dimensionally accurate mouldings

VESTAMID® L-GB30 NC is a glass bead –reinforced heat stabilized Polyamide 12 for injection molding. The material contains about 30% microglass beads, an ageing protective agent and a processing aid for a fast and even form filling. Due to the reinforcement moldings from this compound exhibit a higher strength, an isotropic shrinkage and good heat resistance, excellent for gear housings for mechanical counting mechanisms (e.g.speedometers or water gauges).

Further advantages of VESTAMID® L-GB30 NC are the characterizing properties of PA12, e.g., low water absorption, good dimensional stability and nearly constant mechanical properties at changing ambient humidity.
  
VESTAMID® L-GB30 NC is supplied as cylindrical granules, ready for processing, in moisture-proof bags.
 
Pigmentation may affect values.

Inside the original and undamaged packaging, the product has a shelf life of at least 2 years when stored in dry rooms at temperatures not exceeding 30°C.
 
The results shown have been generated from a low number of production lots. Therefore, they are preliminary and not yet the result of a statistical evaluation. Therefore they must not be used to establish specifications.

For information about processing of VESTAMID®, please follow the general commendations about “Processing of VESTAMID® compounds”. 

FOR FURTHER INFORMATION PLEASE CONTACT US AT EVONIK-HP@EVONIK.COM
OR VISIT OUR PRODUCT AT  WWW.VESTAMID.COM

Caracteristicas de procesamiento y fisicasSeco / CondUnidadesMétodo de ensayo
ISO Data
Indice de fluidez volumétrico, MVR 100 / * cm³/10min ISO 1133
Temperatura 275 / * °C -
Carga 5 / * kg -
Contracción posterior al moldeo, paralelo 0.6 / * % ISO 294-4, 2577
Contracción posterior al moldeo, normal 0.7 / * % ISO 294-4, 2577
Propiedades mecánicasSeco / CondUnidadesMétodo de ensayo
ISO Data
Módulo de tracción 2100 / 1800 MPa ISO 527
Esfuerzo de fluencia 47 / 37 MPa ISO 527
Alarg. en límite elástico 5 / 5 % ISO 527
Alarg. nominal a rotura 20 / >50 % ISO 527
Módulo de plastodeformación, 1h * / 1600 MPa ISO 899-1
Módulo de plastodeformación, 1000h * / 1100 MPa ISO 899-1
Resistencia al impacto Charpy, +23°C 160 / N kJ/m² ISO 179/1eU
Type of failure C / - - -
Resistencia al impacto Charpy, -30°C 160 / N kJ/m² ISO 179/1eU
Type of failure C / - - -
Resistencia al impacto Charpy c/entalla, +23°C 4.4 / 6 kJ/m² ISO 179/1eA
Type of failure C / C - -
Resistencia al impacto Charpy c/entalla, -30°C 6 / 6 kJ/m² ISO 179/1eA
Type of failure C / C - -
Propiedades térmicasSeco / CondUnidadesMétodo de ensayo
ISO Data
Temperatura de fusión, 10°C/min 178 / * °C ISO 11357-1/-3
Estabilidad al calor, 1.80 MPa 55 / * °C ISO 75-1/-2
Estabilidad al calor, 0.45 MPa 150 / * °C ISO 75-1/-2
Temp. reblandecimiento Vicat, B 155 / * °C ISO 306
Coef.de expansión térmica lineal, paralelo 130 / * E-6/K ISO 11359-1/-2
Coef.de expansión térmica lineal, normal 130 / * E-6/K ISO 11359-1/-2
Combustibilidad a 1.5mm esp. nom. HB / * class IEC 60695-11-10
Espesores de probeta 1.5 / * mm -
Yellow Card disponible sí / * - -
Combustibilidad a espesor h HB / * class IEC 60695-11-10
Espesores de probeta 0.8 / * mm -
Yellow Card disponible sí / * - -
Propiedades eléctricasSeco / CondUnidadesMétodo de ensayo
ISO Data
Constante dieléctrica, 100Hz 4.1 / 5 - IEC 62631-2-1
Constante dieléctrica, 1MHz 3.5 / 4 - IEC 62631-2-1
Factor de pérdidas dieléctricas, 100Hz 310 / 600 E-4 IEC 62631-2-1
Factor de pérdidas dieléctricas, 1MHz 230 / 370 E-4 IEC 62631-2-1
Resistividad volumétrica específica >1E13 / 2E12 Ohm*m IEC 62631-3-1
Resistividad superficial específica * / 1E15 Ohm IEC 62631-3-2
Resistencia dieléctrica - / 36 kV/mm IEC 60243-1
Indice comparativo de linea de fuga 600 / 600 - IEC 60112
Otras propiedadesSeco / CondUnidadesMétodo de ensayo
Absorción de agua 1.1 / * % Sim. to ISO 62
Absorción de humedad 0.5 / * % Sim. to ISO 62
Densidad 1250 / 1260 kg/m³ ISO 1183
Funciones
Viscosidad-velocidad de cizallamiento , VESTAMID® L-GB30, PA12-GB30, Evonik
Tensión de cizalla-velocidad de cizalla , VESTAMID® L-GB30, PA12-GB30, Evonik
Módulo de cizallamiento dinámico-temperatura , VESTAMID® L-GB30 (Seco), PA12-GB30, Evonik
Esfuerzo-alargamiento , VESTAMID® L-GB30 (Seco), PA12-GB30, Evonik
Módulo secante-alargamiento , VESTAMID® L-GB30 (Seco), PA12-GB30, Evonik
Esfuerzo-alargamiento (isocrono) 23°C, VESTAMID® L-GB30 (Cond), PA12-GB30, Evonik
Módulo de plastodeformación-tiempo 23°C, VESTAMID® L-GB30 (Cond), PA12-GB30, Evonik
Curva de creep 23°C, VESTAMID® L-GB30 (Cond), PA12-GB30, Evonik
Características
Procesamiento y forma de entrega
Moldeo por inyección
Forma de suministro
Sémola, Color natural
Aditivos
Lubricante
Características especiales
Estable contra el calor
Características
Baja deformación
Disponibilidad regional
Disclaimer
Copyright Altair Engineering GmbH. Altair Engineering GmbH assumes no liability for the system to be free of errors. The user takes sole responsibility for the use of this data under the exclusion of every liability from Altair Engineering GmbH; this is especially valid for claims of compensation resulting from consequential damages. Altair explicitly points out that any decision about the application of materials must be double checked with the producer of this material. This includes all contents of this system. Copyright laws are applicable for the content of this system.
Created: Source: www.materialdatacenter.com


Material Data Center is provided by M-Base Engineering + Software GmbH. M-Base Engineering + Software GmbH assumes no liability for the system to be free of errors. Any decision about the application of materials must be double checked with the producer of this material.

Additional information about this material, like producer contact address, etc. can be found at www.materialdatacenter.com. For access to this extra information a registration is requested. Free online registration is available.