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This is the free Material Data Center Datasheet of KOPA® KN333HB640BL - PA66 - Kolon Industries

Material Data Center offers the following functions for KOPA® KN333HB640BL:
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Caracteristicas de procesamiento y fisicas - Propiedades mecánicas - Propiedades térmicas - Propiedades eléctricas - Otras propiedades
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Caracteristicas de procesamiento y fisicasValorUnidadesMétodo de ensayo
ASTM Data
Contracción posterior al moldeo, paralelo 0.004 mm/mm ASTM D 955
Propiedades mecánicasValorUnidadesMétodo de ensayo
ASTM Data
Esfuerzo de tracción 147 MPa ASTM D 638
Módulo de flexión 7061 MPa ASTM D 790
Resistencia a la flexión 235 MPa ASTM D 790
Dureza Rockwell R 120 - ASTM D 785
Resistencia al impacto Izod con entalla, 1/8 in 69 J/m ASTM D 256
Propiedades térmicasValorUnidadesMétodo de ensayo
ASTM Data
Combustibilidad UL 94 HB - UL 94
Coeficiente de dilatación térmica, long. 30 E-6/K ASTM D 696
Estabilidad al calor @ 66 psi 252 °C ASTM D 648
Estabilidad al calor @ 264 psi 245 °C ASTM D 648
Temperatura de fusión 255 °C ASTM D 3418
Propiedades eléctricasValorUnidadesMétodo de ensayo
ASTM Data
Resistencia dieléctrica, tiempo corto 21 kV/mm ASTM D 149
Constante dieléctrica, 1 MHz 3.4 - ASTM D 150
Resistencia al arco 135 s ASTM D 495
Otras propiedadesValorUnidadesMétodo de ensayo
Densidad 1440 kg/m³ ASTM D 792
Características
Forma de suministro
Negro
Características especiales
Estable contra el calor
Disponibilidad regional
Norteamérica, Asia Pacifico
Disclaimer
Copyright Altair Engineering GmbH. Altair Engineering GmbH assumes no liability for the system to be free of errors. The user takes sole responsibility for the use of this data under the exclusion of every liability from Altair Engineering GmbH; this is especially valid for claims of compensation resulting from consequential damages. Altair explicitly points out that any decision about the application of materials must be double checked with the producer of this material. This includes all contents of this system. Copyright laws are applicable for the content of this system.
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