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This is the free Material Data Center Datasheet of LUVOCOM EOG-400 - PEEK-CF - LEHVOSS Group

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Processing/Physical CharacteristicsValueUnitTest Standard
ISO Data
Melt volume-flow rate, MVR 10 cm³/10min ISO 1133
Temperature 380 °C -
Load 10 kg -
Molding shrinkage, parallel 0.3 % ISO 294-4, 2577
Mechanical propertiesValueUnitTest Standard
ISO Data
Tensile Modulus 14500 MPa ISO 527
Tensile Strength 176 MPa ISO 527
Flexural modulus, 23°C 12500 MPa ISO 178
Charpy impact strength, +23°C 48 kJ/m² ISO 179/1eU
Charpy impact strength, -30°C 45 kJ/m² ISO 179/1eU
Charpy notched impact strength, +23°C 7 kJ/m² ISO 179/1eA
Charpy notched impact strength, -30°C 7 kJ/m² ISO 179/1eA
Thermal propertiesValueUnitTest Standard
ISO Data
Temp. of deflection under load, 1.80 MPa 280 °C ISO 75-1/-2
Burning behav. at thickness h V-0 class IEC 60695-11-10
Electrical propertiesValueUnitTest Standard
ISO Data
Surface resistivity 1E10 Ohm IEC 62631-3-2
Other propertiesValueUnitTest Standard
Density 1400 kg/m³ ISO 1183
Processing Recommendation Injection MoldingValueUnitTest Standard
Pre-drying - Temperature 150 °C -
Pre-drying - Time 3 - 6 h -
Processing humidity ≤0.05 % -
Melt temperature 390 °C -
Mold temperature 170 - 200 °C -
Zone 1 360 - 370 °C -
Zone 2 380 - 390 °C -
Zone 3 390 - 400 °C -
Nozzle temperature 360 - 380 °C -
Characteristics
Processing
Injection Molding
Delivery form
Black
Features
Low Warpage
Regional Availability
North America, Europe, Asia Pacific
Disclaimer
Copyright Altair Engineering GmbH. Altair Engineering GmbH assumes no liability for the system to be free of errors. The user takes sole responsibility for the use of this data under the exclusion of every liability from Altair Engineering GmbH; this is especially valid for claims of compensation resulting from consequential damages. Altair explicitly points out that any decision about the application of materials must be double checked with the producer of this material. This includes all contents of this system. Copyright laws are applicable for the content of this system.
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