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This is the free Material Data Center Datasheet of HOSTAFORM® S 27064 - POM - Celanese

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Product Texts
Chemical abbreviation according to ISO 1043-1: POM-HI Molding compound ISO 29988- POM-K, M-GNPR, 05-001 POM copolymer, modified Easy flowing, elastomer-containing injection molding type based on HOSTAFORM® C 27021 with high toughness, and slightly lower hardness, rigidity and chemical resistance than the basic type; high resistance to thermal and oxidative degradation. UL-registration in natural and a thickness more than 1.57 mm as UL 94 HB. Burning rate ISO 3795 and FMVSS 302 < 100 mm/min for a thickness more than 1 mm thickness. Ranges of applications: For thin-walled molded parts with high energy-absorbing capacity. UL = Underwriters Laboratories (USA) FMVSS = Federal Motor Vehicle Safety Standard (USA)

Flammability @1.6mm nom. thickn.HB-
Flammability at thickness h (3.17 mm)HBUL recognition (h)
Processing/Physical CharacteristicsValueUnitTest Standard
ISO Data
Melt volume-flow rate, MVR 18 cm³/10min ISO 1133
Temperature 190 °C -
Load 2.16 kg -
Molding shrinkage, parallel 1.8 % ISO 294-4, 2577
Molding shrinkage, normal 1.7 % ISO 294-4, 2577
Mechanical propertiesValueUnitTest Standard
ISO Data
Tensile Modulus 1700 MPa ISO 527
Yield stress 44 MPa ISO 527
Yield strain 10 % ISO 527
Nominal strain at break 35 % ISO 527
Charpy impact strength, +23°C 150 kJ/m² ISO 179/1eU
Charpy impact strength, -30°C 110 kJ/m² ISO 179/1eU
Charpy notched impact strength, +23°C 11 kJ/m² ISO 179/1eA
Charpy notched impact strength, -30°C 6 kJ/m² ISO 179/1eA
Thermal propertiesValueUnitTest Standard
ISO Data
Melting temperature, 10°C/min 166 °C ISO 11357-1/-3
Temp. of deflection under load, 1.80 MPa 77 °C ISO 75-1/-2
Coeff. of linear therm. expansion, parallel 130 E-6/K ISO 11359-1/-2
Burning Behav. at 1.5 mm nom. thickn. HB class IEC 60695-11-10
Thickness tested 1.6 mm -
Burning Behav. at thickness h HB class IEC 60695-11-10
Thickness tested 3.2 mm -
Yellow Card available yes - -
Electrical propertiesValueUnitTest Standard
ISO Data
Relative permittivity, 100Hz 4.4 - IEC 62631-2-1
Relative permittivity, 1MHz 4.4 - IEC 62631-2-1
Dissipation factor, 100Hz 100 E-4 IEC 62631-2-1
Dissipation factor, 1MHz 200 E-4 IEC 62631-2-1
Volume resistivity 1E11 Ohm*m IEC 62631-3-1
Surface resistivity 1E13 Ohm IEC 62631-3-2
Electric strength 28 kV/mm IEC 60243-1
Other propertiesValueUnitTest Standard
Water absorption 0.65 % Sim. to ISO 62
Humidity absorption 0.25 % Sim. to ISO 62
Density 1370 kg/m³ ISO 1183
Diagrams
Viscosity-shear rate , HOSTAFORM® S 27064, POM, Celanese
Shearstress-shear rate , HOSTAFORM® S 27064, POM, Celanese
Dynamic Shear modulus-temperature , HOSTAFORM® S 27064, POM, Celanese
Stress-strain , HOSTAFORM® S 27064, POM, Celanese
Secant modulus-strain , HOSTAFORM® S 27064, POM, Celanese
Characteristics
Processing
Injection Molding
Delivery form
Pellets, Natural Color
Additives
Release agent
Special Characteristics
High impact or impact modified
Features
Thermal Stability, Copolymer
Chemical Resistance
General Chemical Resistance, Oxidation Resistance
Applications
Automotive
Regional Availability
North America, Europe, South and Central America, Near East/Africa
Disclaimer
Copyright Altair Engineering GmbH. Altair Engineering GmbH assumes no liability for the system to be free of errors. The user takes sole responsibility for the use of this data under the exclusion of every liability from Altair Engineering GmbH; this is especially valid for claims of compensation resulting from consequential damages. Altair explicitly points out that any decision about the application of materials must be double checked with the producer of this material. This includes all contents of this system. Copyright laws are applicable for the content of this system.
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