Complete Set of CAMPUS® Data, ASTM Data, Biopolymer Database, Application Database, Tradename Database, Literature Database, Toolbox.

Material datasheets available free. Online registration at: www.materialdatacenter.com

Material Data Center is a leading international information system for the plastics industry. Material Data Center offers a comprehensive plastics database, calculation tools, CAE interfaces, a literature database and an application database. For more information about Material Data Center visit www.materialdatacenter.com.

This is the free Material Data Center Datasheet of HOSTAFORM® M30RS - POM - Celanese

Material Data Center offers the following functions for HOSTAFORM® M30RS:
unit conversion, PDF datasheet print, comparison with other plastics, snap fit calculation, beam deflection calculation, CAE Interfaces

Check here, which other Hostaform datasheets, application examples or technical articles are available in Material Data Center

Use the following short links to get directly to the properties of interest in this datasheet:
Any use of this information falls under the rules of our disclaimer.
Processing/Physical CharacteristicsValueUnitTest Standard
ISO Data
Melt volume-flow rate, MVR 2.2 cm³/10min ISO 1133
Temperature 190 °C -
Load 2.16 kg -
Molding shrinkage, parallel 2.2 % ISO 294-4, 2577
Molding shrinkage, normal 1.8 % ISO 294-4, 2577
Mechanical propertiesValueUnitTest Standard
ISO Data
Tensile Modulus 2500 MPa ISO 527
Yield stress 60 MPa ISO 527
Yield strain 12 % ISO 527
Charpy impact strength, +23°C 250 kJ/m² ISO 179/1eU
Charpy impact strength, -30°C 190 kJ/m² ISO 179/1eU
Charpy notched impact strength, +23°C 10 kJ/m² ISO 179/1eA
Thermal propertiesValueUnitTest Standard
ISO Data
Melting temperature, 10°C/min 166 °C ISO 11357-1/-3
Temp. of deflection under load, 1.80 MPa 92 °C ISO 75-1/-2
Coeff. of linear therm. expansion, parallel 120 E-6/K ISO 11359-1/-2
Coeff. of linear therm. expansion, normal 120 E-6/K ISO 11359-1/-2
Other propertiesValueUnitTest Standard
Water absorption 0.75 % Sim. to ISO 62
Humidity absorption 0.2 % Sim. to ISO 62
Density 1410 kg/m³ ISO 1183
Characteristics
Processing
Injection Molding, Film Extrusion, Profile Extrusion, Sheet Extrusion, Other Extrusion, Blow Molding, Calandering
Delivery form
Pellets
Additives
Release agent
Features
Copolymer
Other text information
Injection molding
Drying is generally not required because Celcon® and Hostaform® acetal copolymers are not hydroscopic nor are they degraded by moisture during processing. Excessive moisture can lead to splay (silver streaking) in molded parts. For better uniformity in molding especially when using regrind or material that has been stored in containers open to the atmosphere, recommended drying conditions are 80 C (180 F) for 3hours. Desiccant hopper dryers are not required. Maximum water content = 0.35%
Standard reciprocating screw injection molding machines with a high compression screw (minimum 3:1 and preferably 4:1) and low back pressure (0.35 Mpa/50 PSI) are favored. Using a low compression screw (I.E. general purpose 2:1 compression ratio) can result in unmelted particles and poor melt homogeneity. Using a high back pressure to make up for a low compression ratio may lead to excessive shear heating and deterioration of the material.

Melt Temperature: Preferred range 182-199 C (360-390 F). Melt temperature should never exceed 230 C (450 F).

Mold Surface Temperature: Preferred range 82-93 C (180-200 F) especially with wall thickness less than 1.5 mm (0.060 in.). May require mold temperature as high as 120 C (250 F) to reproduce mold surface or to assure minimal molded in stress. Wall thickness greater than 3mm (1/8 in.) may use a cooler (65 C/150 F) mold surface temperature and wall thickness over 6mm (1/4 in.) may use a cold mold surface down to 25 C (80 F). In general, mold surface temperatures lower than 82 C (180 F) may hinder weld line formation and produce a hazy surface or a surface with flow lines, pits and other included defects that can hinder part performance.
Postprocessing conditioning and moisturizing are not required. It may be necessary to fixture large or complicated parts with varying wall thickness to prevent warpage while cooling to ambient temperature.
Film extrusion
Drying is generally not required because Celcon materials are not hydroscopic nor are they degraded by moisture during processing. Excessive moisture can cause surface defects on the extruded film. For better uniformity especially when using regrind or material that has been stored in containers open to the atmosphere, recommended drying conditions are 3 Hrs. at 80 C (180 F). Desiccant hopper dryers are not required. Max. moisture content = 0.35%.
Standard extruders with a length to diameter ratio of at least 20:1 are recommended. The screw should be a high compression ratio of at least 3:1 and preferably 4:1 to assure good melting and melt homogeneity. The design should be approximately 35% each for feed and metering sections with the remaining 30% as the transition zone.

Melt temperature: 160-220 C (320-430 F)
Postprocessing conditioning or moisturizing is not required.
Other extrusion
Drying is generally not required because Celcon materials are not hydroscopic nor are they degraded by moisture during processing. Excessive moisture can cause surface defects. For better uniformity especially when using regrind or material that has been stored in containers open to the atmosphere, recommended drying is 3 hours at 80 C (180 F). Desiccant hopper dryers are not required. Max. moisture content = 0.35%
Standard extruders with a length to diameter ratio of at least 20:1 are recommended. The screw should be a high compression ratio of at least 3:1 and preferably 4:1 to assure good melting and uniform melt homogeneity. The design should be approximately 35% each for the feed and metering sections with the remaining 30% as transition zone.

Melt temperature 180-220 C (355-430F)
Postprocessing conditioning or moisturizing are not required. For thick walled sections (>3mm or 1/8 in.), annealing is recommended to reduce internal stresses.

Annealing temperature: 130-140 C (265-285 F)

Annealing time: 10 min/mm thickness
Profile extrusion
Drying is generally not required because Celcon materials are not hydroscopic nor are they degraded by moisture during processing. Excessive moisture can cause surface defects on the extrusion. For better uniformity especially when using regrind or material that has been stored in containers open to the atmosphere, recommended drying conditions are 3 Hrs. at 80 C (180 F). Desiccant hopper dryers are not required. Max. moisture content = 0.035%.
Standard extruders with a length to diameter ratio of at least 20:1 are recommended. The screw should be a high compression ratio of at least 3:1 and preferably 4:1 to assure good melting and melt homogeneity. The design should be approximately 35% each for feed and metering sections with the remaining 30% as the transition zone.

Melt temperature: 180-220 C (360-430 F).
Postprocessing or moisturizing is not required. For thick walled extrusions (>3 mm or 1/8 in.), annealing is recommended to reduce internal stresses.

Annealing temperature: 130-140 C (265-285 F)
Annealing time: 10 min/mm thickness
Sheet extrusion
Drying is generally not required because Celcon materials are not hydroscopic nor are they degraded by moisture during processing. Excessive moisture can lead to surface defects. For better uniformity in sheet extrusion especially when using regrind or material that has been stored in containers open to the atmosphere, recommended drying is 3 hours at 80 C (180 F). Desiccant hopper dryers are not required. Max. water content = 0.35%.
Standard extruders with a length to diameter ratio of at least 20:1 are recommended. The screw should be a high compression ratio (at least 3:1 and preferably 4:1) to assure good melting and uniform melt homogeneity. The screw design should be approximately 35% each for the feed and metering sections with the remaining 30% as the transition zone.

Melt temperature 180-190 C (355-375 F).
Postprocessing conditioning or moisturizing is not required. For thick walled sections (>3mm or 1/8 in.), annealing is recommended to reduce internal stresses.

Annealing temperature: 130-140 C (265-285 F)

Annealing time: 10 min/mm wall thickness
Blow molding
Consult product information services.
Consult product information services.
Consult product information services.
Calandering
Consult product information services.
Consult product information services.
Consult product information services.
Disclaimer
Copyright Altair Engineering GmbH. Altair Engineering GmbH assumes no liability for the system to be free of errors. The user takes sole responsibility for the use of this data under the exclusion of every liability from Altair Engineering GmbH; this is especially valid for claims of compensation resulting from consequential damages. Altair explicitly points out that any decision about the application of materials must be double checked with the producer of this material. This includes all contents of this system. Copyright laws are applicable for the content of this system.
Created: Source: www.materialdatacenter.com


Material Data Center is provided by M-Base Engineering + Software GmbH. M-Base Engineering + Software GmbH assumes no liability for the system to be free of errors. Any decision about the application of materials must be double checked with the producer of this material.

Additional information about this material, like producer contact address, etc. can be found at www.materialdatacenter.com. For access to this extra information a registration is requested. Free online registration is available.