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This is the free Material Data Center Datasheet of HOSTAFORM® C 9021 GV1/30 3134 - POM-GF30 - Celanese

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Product Texts
POM copolymer Injection molding type, reinforced with ca 26 % glass fibers; high resistance to thermal and oxidative degradation; reduced thermal expansion and shrinkage. Product is compliant with European Food Regulation EU 10/2011 and FDA Food Regulation FDA21CFR 177.2470 Ranges of applications: For molded parts with very high strength and rigidity as well as higher hardness.

Flammability @1.6mm nom. thickn.HB-
Flammability at thickness h (3.18 mm)HBUL recognition (h)
Processing/Physical CharacteristicsValueUnitTest Standard
ISO Data
Melt volume-flow rate, MVR 4 cm³/10min ISO 1133
Temperature 190 °C -
Load 2.16 kg -
Molding shrinkage, parallel 0.6 % ISO 294-4, 2577
Molding shrinkage, normal 1.0 % ISO 294-4, 2577
Density of melt 1350 kg/m³ -
Thermal conductivity of melt 0.215 W/(m K) -
Spec. heat capacity of melt 1810 J/(kg K) -
Eff. thermal diffusivity 6.51E-8 m²/s -
Ejection temperature 140 °C -
Mechanical propertiesValueUnitTest Standard
ISO Data
Tensile Modulus 9200 MPa ISO 527
Stress at break 135 MPa ISO 527
Strain at break 2.5 % ISO 527
Charpy impact strength, +23°C 30 kJ/m² ISO 179/1eU
Charpy impact strength, -30°C 35 kJ/m² ISO 179/1eU
Charpy notched impact strength, +23°C 8 kJ/m² ISO 179/1eA
Charpy notched impact strength, -30°C 8 kJ/m² ISO 179/1eA
Thermal propertiesValueUnitTest Standard
ISO Data
Melting temperature, 10°C/min 166 °C ISO 11357-1/-3
Temp. of deflection under load, 1.80 MPa 160 °C ISO 75-1/-2
Temp. of deflection under load, 8.00 MPa 125 °C ISO 75-1/-2
Coeff. of linear therm. expansion, parallel 40 E-6/K ISO 11359-1/-2
Coeff. of linear therm. expansion, normal 80 E-6/K ISO 11359-1/-2
Burning Behav. at 1.5 mm nom. thickn. HB class IEC 60695-11-10
Thickness tested 1.6 mm -
Burning Behav. at thickness h HB class IEC 60695-11-10
Thickness tested 3.2 mm -
Yellow Card available yes - -
Electrical propertiesValueUnitTest Standard
ISO Data
Relative permittivity, 100Hz 4.3 - IEC 62631-2-1
Relative permittivity, 1MHz 4.3 - IEC 62631-2-1
Dissipation factor, 100Hz 30 E-4 IEC 62631-2-1
Dissipation factor, 1MHz 60 E-4 IEC 62631-2-1
Volume resistivity 1E12 Ohm*m IEC 62631-3-1
Surface resistivity 1E14 Ohm IEC 62631-3-2
Electric strength 40 kV/mm IEC 60243-1
Other propertiesValueUnitTest Standard
Water absorption 0.9 % Sim. to ISO 62
Humidity absorption 0.17 % Sim. to ISO 62
Density 1600 kg/m³ ISO 1183
Diagrams
Viscosity-shear rate , HOSTAFORM® C 9021 GV1/30 3134, POM-GF30, Celanese
Shearstress-shear rate , HOSTAFORM® C 9021 GV1/30 3134, POM-GF30, Celanese
Dynamic Shear modulus-temperature , HOSTAFORM® C 9021 GV1/30 3134, POM-GF30, Celanese
Stress-strain , HOSTAFORM® C 9021 GV1/30 3134, POM-GF30, Celanese
Secant modulus-strain , HOSTAFORM® C 9021 GV1/30 3134, POM-GF30, Celanese
Characteristics
Processing
Injection Molding
Delivery form
Pellets
Additives
Release agent
Special Characteristics
Heat stabilized or stable to heat
Features
Copolymer
Chemical Resistance
Oxidation Resistance
Certifications
Food contact, Food approval 10/2011, Food approval FDA 21 CFR, Drinking water contact
Disclaimer
Copyright Altair Engineering GmbH. Altair Engineering GmbH assumes no liability for the system to be free of errors. The user takes sole responsibility for the use of this data under the exclusion of every liability from Altair Engineering GmbH; this is especially valid for claims of compensation resulting from consequential damages. Altair explicitly points out that any decision about the application of materials must be double checked with the producer of this material. This includes all contents of this system. Copyright laws are applicable for the content of this system.
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