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This is the free Material Data Center Datasheet of HOSTAFORM® C 9021 10/9005 - POM - Celanese

Check here, which other Hostaform datasheets, application examples or technical articles are available in Material Data Center

Processing/Physical Characteristics - Mechanical properties - Thermal properties - Electrical properties - Other properties - Diagrams

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Product Texts

Hostaform® C 9021 10/9005 is a nominal 9 melt flow rate acetal copolymer which is capable of being permanently marked by a laser. Parts molded from Hostaform® C 9021 10/9005 can be laser marked with barcodes, identification numbers, designs, 2-D symbology, etc.

Flammability @1.6mm nom. thickn.	HB	-
Flammability at thickness h (3 mm)	HB	UL recognition (h)

Processing/Physical Characteristics	Value	Unit	Test Standard
ISO Data
Melt volume-flow rate, MVR	8	cm³/10min	ISO 1133
Temperature	190	°C	-
Load	2.16	kg	-
Molding shrinkage, parallel	2.0	%	ISO 294-4, 2577
Molding shrinkage, normal	1.8	%	ISO 294-4, 2577
Density of melt	1200	kg/m³	-
Thermal conductivity of melt	0.155	W/(m K)	-
Spec. heat capacity of melt	2210	J/(kg K)	-
Eff. thermal diffusivity	4.85E-8	m²/s	-
Ejection temperature	140	°C	-

Mechanical properties	Value	Unit	Test Standard
ISO Data
Tensile Modulus	2850	MPa	ISO 527
Yield stress	64	MPa	ISO 527
Yield strain	9	%	ISO 527
Nominal strain at break	25	%	ISO 527
Charpy impact strength, +23°C	180	kJ/m²	ISO 179/1eU
Charpy impact strength, -30°C	160	kJ/m²	ISO 179/1eU
Charpy notched impact strength, +23°C	5.5	kJ/m²	ISO 179/1eA
Charpy notched impact strength, -30°C	5	kJ/m²	ISO 179/1eA

Thermal properties	Value	Unit	Test Standard
ISO Data
Melting temperature, 10°C/min	166	°C	ISO 11357-1/-3
Temp. of deflection under load, 1.80 MPa	104	°C	ISO 75-1/-2
Coeff. of linear therm. expansion, parallel	110	E-6/K	ISO 11359-1/-2
Coeff. of linear therm. expansion, normal	110	E-6/K	ISO 11359-1/-2
Burning Behav. at 1.5 mm nom. thickn.	HB	class	IEC 60695-11-10
Thickness tested	1.5	mm	-
Burning Behav. at thickness h	HB	class	IEC 60695-11-10
Thickness tested	3.0	mm	-
Yellow Card available	yes	-	-

Electrical properties	Value	Unit	Test Standard
ISO Data
Relative permittivity, 100Hz	4	-	IEC 62631-2-1
Relative permittivity, 1MHz	4	-	IEC 62631-2-1
Dissipation factor, 100Hz	20	E-4	IEC 62631-2-1
Dissipation factor, 1MHz	50	E-4	IEC 62631-2-1
Volume resistivity	1E12	Ohm*m	IEC 62631-3-1
Surface resistivity	1E14	Ohm	IEC 62631-3-2
Electric strength	35	kV/mm	IEC 60243-1

Other properties	Value	Unit	Test Standard
Water absorption	0.65	%	Sim. to ISO 62
Humidity absorption	0.2	%	Sim. to ISO 62
Density	1410	kg/m³	ISO 1183

Diagrams

Characteristics

Processing

Injection Molding

Delivery form

Pellets

Additives

Release agent

Features

Laser Markable, Copolymer

Regional Availability

North America, Europe, Asia Pacific, South and Central America, Near East/Africa

Other text information

Injection molding

General drying is not necessary due to low moisture absorption of
the resin.

In case of bad storage conditions (water contact or condensed water)
the use of a recirculating air dryer (100 to 120 °C / max. 40 mm
layer / 3 to 6 hours) is recommended.

Max. Water content 0,2 %
Standard injection moulding machines with three phase (15 to 25 D)
plasticating screws will fit.

Conditioning e.g. moisturizing is not necessary.

Disclaimer

Copyright Altair Engineering GmbH. Altair Engineering GmbH assumes no liability for the system to be free of errors. The user takes sole responsibility for the use of this data under the exclusion of every liability from Altair Engineering GmbH; this is especially valid for claims of compensation resulting from consequential damages. Altair explicitly points out that any decision about the application of materials must be double checked with the producer of this material. This includes all contents of this system. Copyright laws are applicable for the content of this system.

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