Complete Set of CAMPUS® Data, ASTM Data, Biopolymer Database, Application Database, Tradename Database, Literature Database, Toolbox.

Material datasheets available free. Online registration at: www.materialdatacenter.com

Material Data Center is a leading international information system for the plastics industry. Material Data Center offers a comprehensive plastics database, calculation tools, CAE interfaces, a literature database and an application database. For more information about Material Data Center visit www.materialdatacenter.com.

This is the free Material Data Center Datasheet of Delrin® 500TL NC010 - (POM+PTFE)-Z - DuPont Engineering Polymers

Material Data Center offers the following functions for Delrin® 500TL NC010:
unit conversion, PDF datasheet print, comparison with other plastics, snap fit calculation, beam deflection calculation, parameters for material models, CAE Interfaces

Check here, which other Delrin datasheets, application examples or technical articles are available in Material Data Center

Use the following short links to get directly to the properties of interest in this datasheet:
Any use of this information falls under the rules of our disclaimer.
Product Texts
Common features of Delrin® acetal resins include mechanical and physical properties such as high mechanical strength and rigidity, excellent fatigue and impact resistance, as well as resistance to moisture, gasoline, lubricants, solvents, and many other neutral chemicals. Delrin® acetal resins also have excellent dimensional stability and good electrical insulating characteristics. They are naturally resilient, self-lubricating, and available in a variety of colors and speciality grades.

Delrin® acetal resin typically is used in demanding applications in the automotive, domestic appliances, sports, industrial engineering, electronics, and consumer goods industries.


Delrin® 500TL is a medium viscosity acetal homopolymer containing 1.5% PTFE Micropowder lubricant.  It is designed for applications requiring reduced wear and friction against steel, itself, or other plastics.
Processing/Physical CharacteristicsValueUnitTest Standard
ISO Data
Melt volume-flow rate, MVR 12 cm³/10min ISO 1133
Temperature 190 °C -
Load 2.16 kg -
Molding shrinkage, parallel 1.8 % ISO 294-4, 2577
Molding shrinkage, normal 1.7 % ISO 294-4, 2577
ASTM Data
Melt Flow Index, MFI 6 g/10min ASTM D 1238
Temperature 190 °C -
Load 1.05 kg -
Mold Shrinkage, MD 0.018 mm/mm ASTM D 955
Mold Shrinkage, TD 0.017 mm/mm ASTM D 955
Mechanical propertiesValueUnitTest Standard
ISO Data
Tensile Modulus 3300 MPa ISO 527
Yield stress 71 MPa ISO 527
Yield strain 13 % ISO 527
Nominal strain at break 20 % ISO 527
Charpy impact strength, +23°C 170 kJ/m² ISO 179/1eU
Charpy impact strength, -30°C 160 kJ/m² ISO 179/1eU
Charpy notched impact strength, +23°C 5 kJ/m² ISO 179/1eA
Charpy notched impact strength, -30°C 4 kJ/m² ISO 179/1eA
ASTM Data
Tensile Modulus 3100 MPa ASTM D 638
Tensile Strength at Yield 67 MPa ASTM D 638
Elongation at Yield 12 % ASTM D 638
Elongation at Break 25 % ASTM D 638
Flexural Modulus 3080 MPa ASTM D 790
Rockwell Hardness R 123 - ASTM D 785
Izod Impact notched, 1/8 in 59 J/m ASTM D 256
Izod Impact notched, Low-Temperature 43 J/m ASTM D 256
Temperature -40 °C -
Thermal propertiesValueUnitTest Standard
ISO Data
Melting temperature, 10°C/min 178 °C ISO 11357-1/-3
Temp. of deflection under load, 1.80 MPa 103 °C ISO 75-1/-2
Temp. of deflection under load, 0.45 MPa 165 °C ISO 75-1/-2
Coeff. of linear therm. expansion, parallel 100 E-6/K ISO 11359-1/-2
Coeff. of linear therm. expansion, normal 100 E-6/K ISO 11359-1/-2
Burning Behav. at 1.5 mm nom. thickn. HB class IEC 60695-11-10
Thickness tested 1.5 mm -
Yellow Card available yes - -
Burning Behav. at thickness h HB class IEC 60695-11-10
Thickness tested 3.0 mm -
Yellow Card available yes - -
ASTM Data
UL 94 Flame rating HB - UL 94
Thickness tested 1.5 mm -
Coefficient of Thermal Expansion, MD 100 E-6/K ASTM D 696
Coefficient of Thermal Expansion, TD 100 E-6/K ASTM D 696
DTUL @ 66 psi 166 °C ASTM D 648
DTUL @ 264 psi 100 °C ASTM D 648
Melting Temperature 178 °C ASTM D 3418
Electrical propertiesValueUnitTest Standard
ISO Data
Relative permittivity, 100Hz 3.6 - IEC 62631-2-1
Relative permittivity, 1MHz 3.6 - IEC 62631-2-1
Volume resistivity 1E12 Ohm*m IEC 62631-3-1
Comparative tracking index 600 - IEC 60112
ASTM Data
Dielectric Strength, Short Time 16.5 kV/mm ASTM D 149
Dissipation Factor, 1 MHz 0.006 - ASTM D 150
Dielectric Constant, 1 MHz 3.6 - ASTM D 150
Surface Resistivity >1E15 Ohm ASTM D 257
Volume Resistivity >1E15 Ohm*cm ASTM D 257
Other propertiesValueUnitTest Standard
Water absorption 0.9 % Sim. to ISO 62
Humidity absorption 0.17 % Sim. to ISO 62
Density 1430 kg/m³ ISO 1183
Water Absorption, 24hr 0.19 % ASTM D 570
Water Absorption, Equilibrium 0.11 % ASTM D 570
Density 1430 kg/m³ ASTM D 792
Diagrams
Viscosity-shear rate , Delrin® 500TL NC010, (POM+PTFE)-Z, DuPont
Shearstress-shear rate , Delrin® 500TL NC010, (POM+PTFE)-Z, DuPont
Stress-strain , Delrin® 500TL NC010, (POM+PTFE)-Z, DuPont
Secant modulus-strain , Delrin® 500TL NC010, (POM+PTFE)-Z, DuPont
Characteristics
Processing
Injection Molding, Film Extrusion, Pipe/Tube Extrusion, Sheet Extrusion, Wire/Cable Extrusion
Delivery form
Pellets, Natural Color
Additives
Lubricants, Release agent
Features
Creep Resistance, Fatigue Resistance, Tribologic Grade, Weldable, Homopolymer
Regional Availability
Other text information
Injection molding
Drying is recommended, but not necessary for newly opened packaging stored in a dry location.
Follow the drying guidelines above in the following cases:

·         If moisture is above the Processing Moisture Content recommendation,

·         When a resin container is damaged,

·         When the material is not properly stored in a dry place at room temperature, or

·         When packaging stays open for a significant time.

Chemical Media Resistance
Acids
Acetic Acid (5% by mass) (23°C)
Citric Acid solution (10% by mass) (23°C)
Lactic Acid (10% by mass) (23°C)
Hydrochloric Acid (36% by mass) (23°C)
Nitric Acid (40% by mass) (23°C)
Sulfuric Acid (38% by mass) (23°C)
Sulfuric Acid (5% by mass) (23°C)
Chromic Acid solution (40% by mass) (23°C)
Bases
Sodium Hydroxide solution (35% by mass) (23°C)
Sodium Hydroxide solution (1% by mass) (23°C)
Ammonium Hydroxide solution (10% by mass) (23°C)
Alcohols
Isopropyl alcohol (23°C)
Methanol (23°C)
Ethanol (23°C)
Hydrocarbons
n-Hexane (23°C)
Toluene (23°C)
iso-Octane (23°C)
Ketones
Acetone (23°C)
Ethers
Diethyl ether (23°C)
Mineral oils
SAE 10W40 multigrade motor oil (23°C)
SAE 10W40 multigrade motor oil (130°C)
SAE 80/90 hypoid-gear oil (130°C)
Insulating Oil (23°C)
Standard Fuels
ISO 1817 Liquid 1 (60°C)
ISO 1817 Liquid 2 (60°C)
ISO 1817 Liquid 3 (60°C)
ISO 1817 Liquid 4 (60°C)
Standard fuel without alcohol (pref. ISO 1817 Liquid C) (23°C)
Standard fuel with alcohol (pref. ISO 1817 Liquid 4) (23°C)
Diesel fuel (pref. ISO 1817 Liquid F) (23°C)
Diesel fuel (pref. ISO 1817 Liquid F) (90°C)
Diesel fuel (pref. ISO 1817 Liquid F) (>90°C)
Salt solutions
Sodium Chloride solution (10% by mass) (23°C)
Sodium Hypochlorite solution (10% by mass) (23°C)
Sodium Carbonate solution (20% by mass) (23°C)
Sodium Carbonate solution (2% by mass) (23°C)
Zinc Chloride solution (50% by mass) (23°C)
Other
Ethyl Acetate (23°C)
Hydrogen peroxide (23°C)
DOT No. 4 Brake fluid (130°C)
Ethylene Glycol (50% by mass) in water (108°C)
1% nonylphenoxy-polyethyleneoxy ethanol in water (23°C)
50% Oleic acid + 50% Olive Oil (23°C)
Water (23°C)
Deionized water (90°C)
Phenol solution (5% by mass) (23°C)
Disclaimer
Copyright Altair Engineering GmbH. Altair Engineering GmbH assumes no liability for the system to be free of errors. The user takes sole responsibility for the use of this data under the exclusion of every liability from Altair Engineering GmbH; this is especially valid for claims of compensation resulting from consequential damages. Altair explicitly points out that any decision about the application of materials must be double checked with the producer of this material. This includes all contents of this system. Copyright laws are applicable for the content of this system.
Created: Source: www.materialdatacenter.com


Material Data Center is provided by M-Base Engineering + Software GmbH. M-Base Engineering + Software GmbH assumes no liability for the system to be free of errors. Any decision about the application of materials must be double checked with the producer of this material.

Additional information about this material, like producer contact address, etc. can be found at www.materialdatacenter.com. For access to this extra information a registration is requested. Free online registration is available.