Complete Set of CAMPUS® Data, ASTM Data, Biopolymer Database, Application Database, Tradename Database, Literature Database, Toolbox.

Material datasheets available free. Online registration at: www.materialdatacenter.com

Material Data Center is a leading international information system for the plastics industry. Material Data Center offers a comprehensive plastics database, calculation tools, CAE interfaces, a literature database and an application database. For more information about Material Data Center visit www.materialdatacenter.com.

This is the free Material Data Center Datasheet of Ultraform® W2320 003 UN Q600 - POM - BASF

Material Data Center offers the following functions for Ultraform® W2320 003 UN Q600:
unit conversion, PDF datasheet print, comparison with other plastics, snap fit calculation, beam deflection calculation, parameters for material models, CAE Interfaces

Check here, which other Ultraform datasheets, application examples or technical articles are available in Material Data Center

Use the following short links to get directly to the properties of interest in this datasheet:
Any use of this information falls under the rules of our disclaimer.
Product Texts
Very free-flowing, rapidly solidifying grade for use where processing is extremely difficult but mechanical properties are lower.

Abbreviated designation according to ISO 1043-1: POM
Designation according to ISO 29988-POM-K,,M-GNR,5-2
Processing/Physical CharacteristicsValueUnitTest Standard
ISO Data
Melt volume-flow rate, MVR 25 cm³/10min ISO 1133
Temperature 190 °C -
Load 2.16 kg -
Molding shrinkage, parallel 2.0 % ISO 294-4, 2577
Molding shrinkage, normal 1.9 % ISO 294-4, 2577
Mechanical propertiesValueUnitTest Standard
ISO Data
Tensile Modulus 2750 MPa ISO 527
Yield stress 63 MPa ISO 527
Yield strain 8.5 % ISO 527
Nominal strain at break 27 % ISO 527
Tensile creep modulus, 1h 2000 MPa ISO 899-1
Tensile creep modulus, 1000h 1350 MPa ISO 899-1
Charpy impact strength, +23°C 170 kJ/m² ISO 179/1eU
Charpy impact strength, -30°C 150 kJ/m² ISO 179/1eU
Charpy notched impact strength, +23°C 4.5 kJ/m² ISO 179/1eA
Charpy notched impact strength, -30°C 4 kJ/m² ISO 179/1eA
Thermal propertiesValueUnitTest Standard
ISO Data
Melting temperature, 10°C/min 166 °C ISO 11357-1/-3
Temp. of deflection under load, 1.80 MPa 95 °C ISO 75-1/-2
Temp. of deflection under load, 0.45 MPa 156 °C ISO 75-1/-2
Vicat softening temperature, B 150 °C ISO 306
Coeff. of linear therm. expansion, parallel 110 E-6/K ISO 11359-1/-2
Burning Behav. at 1.5 mm nom. thickn. HB class IEC 60695-11-10
Thickness tested 1.6 mm -
Yellow Card available yes - -
Burning Behav. at thickness h HB class IEC 60695-11-10
Thickness tested 0.8 mm -
Yellow Card available yes - -
Oxygen index 15 % ISO 4589-1/-2
Electrical propertiesValueUnitTest Standard
ISO Data
Relative permittivity, 100Hz 3.8 - IEC 62631-2-1
Relative permittivity, 1MHz 3.8 - IEC 62631-2-1
Dissipation factor, 100Hz 10 E-4 IEC 62631-2-1
Dissipation factor, 1MHz 65 E-4 IEC 62631-2-1
Volume resistivity 1E12 Ohm*m IEC 62631-3-1
Surface resistivity 1E15 Ohm IEC 62631-3-2
Electric strength 40 kV/mm IEC 60243-1
Comparative tracking index 600 - IEC 60112
Other propertiesValueUnitTest Standard
Water absorption 0.8 % Sim. to ISO 62
Humidity absorption 0.2 % Sim. to ISO 62
Density 1410 kg/m³ ISO 1183
Diagrams
Viscosity-shear rate , Ultraform® W2320 003 UN Q600, POM, BASF
Shearstress-shear rate , Ultraform® W2320 003 UN Q600, POM, BASF
Dynamic Shear modulus-temperature , Ultraform® W2320 003 UN Q600, POM, BASF
Stress-strain , Ultraform® W2320 003 UN Q600, POM, BASF
Secant modulus-strain , Ultraform® W2320 003 UN Q600, POM, BASF
Stress-strain (isochronous) 23°C, Ultraform® W2320 003 UN Q600, POM, BASF
Creep modulus-time 23°C, Ultraform® W2320 003 UN Q600, POM, BASF
Creep curve 23°C, Ultraform® W2320 003 UN Q600, POM, BASF
Stress-strain (isochronous) 40°C, Ultraform® W2320 003 UN Q600, POM, BASF
Creep modulus-time 40°C, Ultraform® W2320 003 UN Q600, POM, BASF
Creep curve 40°C, Ultraform® W2320 003 UN Q600, POM, BASF
Stress-strain (isochronous) 60°C, Ultraform® W2320 003 UN Q600, POM, BASF
Creep modulus-time 60°C, Ultraform® W2320 003 UN Q600, POM, BASF
Creep curve 60°C, Ultraform® W2320 003 UN Q600, POM, BASF
Stress-strain (isochronous) 80°C, Ultraform® W2320 003 UN Q600, POM, BASF
Creep modulus-time 80°C, Ultraform® W2320 003 UN Q600, POM, BASF
Creep curve 80°C, Ultraform® W2320 003 UN Q600, POM, BASF
Stress-strain (isochronous) 100°C, Ultraform® W2320 003 UN Q600, POM, BASF
Creep modulus-time 100°C, Ultraform® W2320 003 UN Q600, POM, BASF
Creep curve 100°C, Ultraform® W2320 003 UN Q600, POM, BASF
Stress-strain (isochronous) 120°C, Ultraform® W2320 003 UN Q600, POM, BASF
Creep modulus-time 120°C, Ultraform® W2320 003 UN Q600, POM, BASF
Creep curve 120°C, Ultraform® W2320 003 UN Q600, POM, BASF
Specific volume-temperature (pvT) , Ultraform® W2320 003 UN Q600, POM, BASF
Tensile modulus-temperature , Ultraform® W2320 003 UN Q600, POM, BASF
Characteristics
Processing
Injection Molding
Delivery form
Pellets
Additives
Release agent
Regional Availability
Other text information
Injection molding
PREPROCESSING
Pre/Post-processing, max. allowed water content: .2 %
Pre/Post-processing, Pre-drying, Temperature: 100 °C
Pre/Post-processing, Pre-drying, Time: 3 h

PROCESSING
injection molding, Melt temperature, range: 185 - 230 °C
injection molding, Melt temperature, recommended: 200 °C
injection molding, Mold temperature, range: 60 - 100 °C
injection molding, Mold temperature, recommended: 90 °C
injection molding, Dwell time, thermoplastics: 10 min
Disclaimer
Copyright Altair Engineering GmbH. Altair Engineering GmbH assumes no liability for the system to be free of errors. The user takes sole responsibility for the use of this data under the exclusion of every liability from Altair Engineering GmbH; this is especially valid for claims of compensation resulting from consequential damages. Altair explicitly points out that any decision about the application of materials must be double checked with the producer of this material. This includes all contents of this system. Copyright laws are applicable for the content of this system.
Created: Source: www.materialdatacenter.com


Material Data Center is provided by M-Base Engineering + Software GmbH. M-Base Engineering + Software GmbH assumes no liability for the system to be free of errors. Any decision about the application of materials must be double checked with the producer of this material.

Additional information about this material, like producer contact address, etc. can be found at www.materialdatacenter.com. For access to this extra information a registration is requested. Free online registration is available.