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This is the free Material Data Center Datasheet of Ultradur® B 6550 LN - PBT - BASF

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Product Texts
High viscosity extrusion grade for loose-buffer tubes in fibre optical cable applications and for semi-finished products, profiles and tubes and sheet.

Abbreviated designation according to ISO 1043-1: PBT
Processing/Physical CharacteristicsValueUnitTest Standard
ISO Data
Melt volume-flow rate, MVR 9.5 cm³/10min ISO 1133
Temperature 250 °C -
Load 2.16 kg -
Mechanical propertiesValueUnitTest Standard
ISO Data
Tensile Modulus 2600 MPa ISO 527
Yield stress 56 MPa ISO 527
Yield strain 3.5 % ISO 527
Nominal strain at break >50 % ISO 527
Charpy impact strength, +23°C N kJ/m² ISO 179/1eU
Charpy impact strength, -30°C 220 kJ/m² ISO 179/1eU
Charpy notched impact strength, +23°C 5 kJ/m² ISO 179/1eA
Charpy notched impact strength, -30°C 5 kJ/m² ISO 179/1eA
Thermal propertiesValueUnitTest Standard
ISO Data
Melting temperature, 10°C/min 223 °C ISO 11357-1/-3
Temp. of deflection under load, 1.80 MPa 50 °C ISO 75-1/-2
Temp. of deflection under load, 0.45 MPa 135 °C ISO 75-1/-2
Coeff. of linear therm. expansion, parallel 115 E-6/K ISO 11359-1/-2
Coeff. of linear therm. expansion, normal 115 E-6/K ISO 11359-1/-2
Burning Behav. at 1.5 mm nom. thickn. HB class IEC 60695-11-10
Thickness tested 1.5 mm -
Burning Behav. at thickness h HB class IEC 60695-11-10
Thickness tested 0.8 mm -
Electrical propertiesValueUnitTest Standard
ISO Data
Relative permittivity, 100Hz 3.4 - IEC 62631-2-1
Relative permittivity, 1MHz 3.2 - IEC 62631-2-1
Dissipation factor, 100Hz 19 E-4 IEC 62631-2-1
Dissipation factor, 1MHz 219 E-4 IEC 62631-2-1
Volume resistivity >1E13 Ohm*m IEC 62631-3-1
Surface resistivity 1E13 Ohm IEC 62631-3-2
Electric strength 39 kV/mm IEC 60243-1
Comparative tracking index 600 - IEC 60112
Other propertiesValueUnitTest Standard
Water absorption 0.4 % Sim. to ISO 62
Humidity absorption 0.25 % Sim. to ISO 62
Density 1300 kg/m³ ISO 1183
Material specific propertiesValueUnitTest Standard
ISO Data
Viscosity number 160 cm³/g ISO 307, 1157, 1628
Characteristics
Processing
Injection Molding, Film Extrusion, Profile Extrusion, Sheet Extrusion, Other Extrusion
Delivery form
Pellets
Regional Availability
Other text information
Injection molding
PREPROCESSING
Pre/Post-processing, max. allowed water content: .04 %
Pre/Post-processing, Pre-drying, Temperature: 80 - 120 °C
Pre/Post-processing, Pre-drying, Time: 4 h

PROCESSING
injection molding, Melt temperature, range: 260 - 270 °C
injection molding, Melt temperature, recommended: 260 °C
injection molding, Mold temperature, range: 40 - 80 °C
injection molding, Mold temperature, recommended: 60 °C
Other extrusion
PREPROCESSING
Pre/Post-processing, max. allowed water content: .04 %
Pre/Post-processing, Pre-drying, Temperature: 80 - 120 °C
Pre/Post-processing, Pre-drying, Time: 4 h

PROCESSING
Extrusion, Prepreg, Melt temperature: 250 - 270 °C
Extrusion, Pipes, Melt temperature: 250 - 270 °C
Extrusion, cable sheathing, Melt temperature: 260 - 270 °C
Profile extrusion
PREPROCESSING
Pre/Post-processing, max. allowed water content: .04 %
Pre/Post-processing, Pre-drying, Temperature: 80 - 120 °C
Pre/Post-processing, Pre-drying, Time: 4 h

PROCESSING
Extrusion, Profiles, Melt temperature: 250 - 270 °C
Sheet extrusion
PREPROCESSING
Pre/Post-processing, max. allowed water content: .04 %
Pre/Post-processing, Pre-drying, Temperature: 80 - 120 °C
Pre/Post-processing, Pre-drying, Time: 4 h

PROCESSING
Extrusion, Plates, Melt temperature: 250 - 270 °C
Disclaimer
Copyright Altair Engineering GmbH. Altair Engineering GmbH assumes no liability for the system to be free of errors. The user takes sole responsibility for the use of this data under the exclusion of every liability from Altair Engineering GmbH; this is especially valid for claims of compensation resulting from consequential damages. Altair explicitly points out that any decision about the application of materials must be double checked with the producer of this material. This includes all contents of this system. Copyright laws are applicable for the content of this system.
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